WS353 SN100C® water soluble solder paste has been developed in response to electronics manufacturers demand for an all-purpose, reliably consistent water-soluble solder paste. WS353 SN100C® offers extended stencil life and tack time, robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys.
WS353 SN100C® can be used in fine pitch printing applications and has proven effective in the assembly of 0201 components. WS353 SN100C® provides consistent printing characteristics and slump resistance during high-speed printing. The excellent activity of WS353 SN100C® makes it a suitable choice when soldering to standard or difficult-to-wet parts, including lead-free alloys and finishes. In addition, WS353 SN100C® has proven to substantially reduce voiding under micro-BGAs. The residues of WS353 SN100C® may be cleaned easily in straight water, with the result being exceptional electrical reliability. In addition, WS353 SN100C® is designed to not foam during washing, even in high-pressure wash systems.
- Broad Printing Process Window
- Excellent Wetting
- Easily Cleaned Residues
- Lengthy Stencil Life and Tack Time
- Reduces Voiding Under BGAs
- Low Foaming during Washing
Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of ½ to 5/8 inch is normally sufficient to begin).
Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties. WS353 SN100C® provides the necessary tack time/force for today’s high-speed placement equipment.
Ensuring proper support of PCBs during assembly and handling will enhance product performance and reliability.