WS353 SN100C® Water Soluble Solder Paste

WS353 SN100C® Water Soluble Solder Paste from AIM® Solder Products

By: AIM® Solder Products  14-Sep-2011
Keywords: Solder Paste, Solder Cream, Sn100c

WS353 SN100C® water soluble solder paste has been developed in response to electronics manufacturers demand for an all-purpose, reliably consistent water-soluble solder paste. WS353 SN100C® offers extended stencil life and tack time, robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys.

WS353 SN100C® can be used in fine pitch printing applications and has proven effective in the assembly of 0201 components. WS353 SN100C® provides consistent printing characteristics and slump resistance during high-speed printing. The excellent activity of WS353 SN100C® makes it a suitable choice when soldering to standard or difficult-to-wet parts, including lead-free alloys and finishes. In addition, WS353 SN100C® has proven to substantially reduce voiding under micro-BGAs. The residues of WS353 SN100C® may be cleaned easily in straight water, with the result being exceptional electrical reliability. In addition, WS353 SN100C® is designed to not foam during washing, even in high-pressure wash systems.


- Broad Printing Process Window
- Excellent Wetting
- Easily Cleaned Residues
- Lengthy Stencil Life and Tack Time
- Reduces Voiding Under BGAs
- Low Foaming during Washing
- Halide-Free

Paste Application:

Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of ½ to 5/8 inch is normally sufficient to begin).

Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties. WS353 SN100C® provides the necessary tack time/force for today’s high-speed placement equipment.

Ensuring proper support of PCBs during assembly and handling will enhance product performance and reliability.

Keywords: Sn100c, Solder Cream, Solder Paste,

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AIM - Your Australian Solder Partner

AIM Products Australia is a leading Australian manufacturer of Tin-Lead and Lead-Free Solder Assembly Materials for the Electronics Industry. Our product line includes solder paste, liquid flux, bar solder, wire solder, solder preforms, adhesives, cleaners, chemicals, plating anodes and indium and gold alloys. AIM's product line also includes a wide variety of lead-free soldering alloys. Advancing technologies continue to present challenges and opportunities for both customer and supplier.